SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.

主权项

1. A substrate processing apparatus comprising:
a spin chuck including a plurality of chuck pins disposed around a substrate, chuck opening/closing mechanisms that press the plurality of chuck pins onto a peripheral edge portion of the substrate to cause the plurality of chuck pins to grip the substrate in a horizontal posture, and a spin motor that rotates the substrate gripped by the plurality of chuck pins; a processing liquid supply device that supplies a processing liquid to the substrate held by the spin chuck; and a heat source disposed above the substrate which is held by the spin chuck, wherein each of the plurality of chuck pins includes: a conductive member including a gripping portion that is softer than the substrate and pressed onto the peripheral edge portion of the substrate, the conductive member being made of a material containing carbon, the conductive member protruding outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate; and a pin cover that covers, in a plan view, an entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.