| 摘要 |
The integrated imaging device comprises a substrate (1) with an integrated circuit (4), a cover (2), a cavity (6) enclosed between the substrate (1) and the cover (2), and a sensor (5) or an array of sensors (5) arranged in the cavity (6). A surface (11, 12) of the substrate (1) or the cover (2) opposite the cavity (6) has a structure (8) directing incident radiation. The surface structure (8) may be a plate zone or a Fresnel lens focusing infrared radiation and is preferably etched into the surface of the substrate or cover, respectively. At least one through-substrate via (9) may be provided to connecting the sensor (5) or array of sensors (5) electrically with a connection pad (10) on the surface (11) of the substrate (1) opposite the cavity (6). |
