| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin, a wiring board and a method for manufacturing the wiring board which can easily exhibit high adhesive strength to a wiring conductor even when an uneven shape on the surface of an insulating resin layer is small.SOLUTION: A resin composition contains (A) an epoxy resin having two or more epoxy groups in one molecule, (B) an ultraviolet active type ester group-containing compound, (C) isocyanate silane, and (D) an epoxy resin curing accelerator. |
