发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To achieve downsizing and improved throughput of an apparatus, and make it possible to correspond to an arrangement of a substrate delivery part of a different exposure device.SOLUTION: A substrate processing apparatus comprises: a processing block including a coating treatment part and a development processing part of a plurality of laminated substrates; an exposure block S4 including an exposure processing part of the substrates; and an interface block S3 connected to the processing block, for connecting the processing block and the exposure block, in which the interface block includes a shelf unit U6 in which buffer parts BF for standby of the substrates are stacked, and a first substrate transfer mechanism 60A and a second substrate transfer mechanism 60B which are arranged on both sides of the shelf unit and which are made in a manner such that both are capable of delivering a substrate with respect to the shelf unit and one of the mechanisms is capable of delivering a substrate with respect to the exposure block.</p>
申请公布号 JP2014212344(A) 申请公布日期 2014.11.13
申请号 JP20140151419 申请日期 2014.07.25
申请人 TOKYO ELECTRON LTD 发明人 ENOKIDA SUGURU;NAKAHARADA MASAHIRO;NAKAJIMA SEIJI;MIYATA RYO;NAKAJO MASATO
分类号 H01L21/677;B65G49/07;H01L21/027 主分类号 H01L21/677
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