发明名称 |
ELECTROCHEMICAL CELL PACKAGING MATERIAL |
摘要 |
Provided is an electrochemical cell packaging material with excellent electrolyte resistance. An electrochemical cell packaging material includes the following in a laminated structure: a substrate layer that, at a minimum, includes resin film; a protective layer that is arranged as the outermost layer and protects the substrate layer; a thermal adhesion layer that is arranged as the innermost layer and which includes thermal adhesion resin; and a barrier layer that includes metal foil and is arranged between the substrate layer and the thermal adhesion layer. The protective layer is formed of an epoxy resin that has bisphenol A or bisphenol F as an element in the backbone. |
申请公布号 |
US2014335403(A1) |
申请公布日期 |
2014.11.13 |
申请号 |
US201214353198 |
申请日期 |
2012.11.08 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
Akita Hirohisa;Okushita Masataka;Watanabe Daisuke;Yokota Kazuhiko |
分类号 |
H01M2/02 |
主分类号 |
H01M2/02 |
代理机构 |
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代理人 |
|
主权项 |
1. An electrochemical cell packaging material comprising, as layers laminated together, at least:
a base material layer formed of a resin film; a protective layer arranged as an outer layer, for protecting the base material layer; a thermally adhesive layer arranged as an innermost layer and formed of a thermally adhesive resin; and a barrier layer arranged between the base material layer and the thermally adhesive layer and formed of a metal foil, wherein the protective layer is formed of an epoxy resin having bisphenol A or bisphenol F as skeletal units. |
地址 |
Tokyo JP |