发明名称 ELECTROCHEMICAL CELL PACKAGING MATERIAL
摘要 Provided is an electrochemical cell packaging material with excellent electrolyte resistance. An electrochemical cell packaging material includes the following in a laminated structure: a substrate layer that, at a minimum, includes resin film; a protective layer that is arranged as the outermost layer and protects the substrate layer; a thermal adhesion layer that is arranged as the innermost layer and which includes thermal adhesion resin; and a barrier layer that includes metal foil and is arranged between the substrate layer and the thermal adhesion layer. The protective layer is formed of an epoxy resin that has bisphenol A or bisphenol F as an element in the backbone.
申请公布号 US2014335403(A1) 申请公布日期 2014.11.13
申请号 US201214353198 申请日期 2012.11.08
申请人 DAI NIPPON PRINTING CO., LTD. 发明人 Akita Hirohisa;Okushita Masataka;Watanabe Daisuke;Yokota Kazuhiko
分类号 H01M2/02 主分类号 H01M2/02
代理机构 代理人
主权项 1. An electrochemical cell packaging material comprising, as layers laminated together, at least: a base material layer formed of a resin film; a protective layer arranged as an outer layer, for protecting the base material layer; a thermally adhesive layer arranged as an innermost layer and formed of a thermally adhesive resin; and a barrier layer arranged between the base material layer and the thermally adhesive layer and formed of a metal foil, wherein the protective layer is formed of an epoxy resin having bisphenol A or bisphenol F as skeletal units.
地址 Tokyo JP