发明名称 CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA PHOTO IRRADIATION OR MICROWAVE HEATING
摘要 To provide a conductive pattern formation method capable of improving conductivity of a conductive pattern and a composition for forming a conductive pattern by means of photo irradiation or microwave heating. A composition for forming a conductive pattern that contains copper particles each having a copper oxide thin film formed on the entire or a part of a surface thereof, plate-like silver particles each being 10 to 200 nm thickness, and a binder resin is prepared. The composition for forming a conductive pattern is printed in a pattern having a desired shape on a substrate. Photo irradiation or microwave heating is applied to the printed pattern to thereby produce a copper/silver sintered body, to form a conductive film.
申请公布号 US2014332734(A1) 申请公布日期 2014.11.13
申请号 US201214360361 申请日期 2012.11.26
申请人 SHOWA DENKO K.K. 发明人 Uchida Hiroshi
分类号 H05K3/12;C09D5/24 主分类号 H05K3/12
代理机构 代理人
主权项 1. A composition for forming a conductive pattern by means of photo irradiation or microwave heating, comprising: copper particles; plate-like silver particles each having a thickness of 10 to 200 nm; and a binder resin.
地址 Minato-ku, Tokyo JP