发明名称 |
CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA PHOTO IRRADIATION OR MICROWAVE HEATING |
摘要 |
To provide a conductive pattern formation method capable of improving conductivity of a conductive pattern and a composition for forming a conductive pattern by means of photo irradiation or microwave heating. A composition for forming a conductive pattern that contains copper particles each having a copper oxide thin film formed on the entire or a part of a surface thereof, plate-like silver particles each being 10 to 200 nm thickness, and a binder resin is prepared. The composition for forming a conductive pattern is printed in a pattern having a desired shape on a substrate. Photo irradiation or microwave heating is applied to the printed pattern to thereby produce a copper/silver sintered body, to form a conductive film. |
申请公布号 |
US2014332734(A1) |
申请公布日期 |
2014.11.13 |
申请号 |
US201214360361 |
申请日期 |
2012.11.26 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
Uchida Hiroshi |
分类号 |
H05K3/12;C09D5/24 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
1. A composition for forming a conductive pattern by means of photo irradiation or microwave heating, comprising:
copper particles; plate-like silver particles each having a thickness of 10 to 200 nm; and a binder resin. |
地址 |
Minato-ku, Tokyo JP |