Controls of Ambient Environment During Wafer Drying Using Proximity Head

摘要

A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.

主权项

1. A method for processing a substrate, comprising:
generating a fluid meniscus to process the substrate, the fluid meniscus being defined between a surface of a proximity head and a surface of the substrate, and the proximity head is configured to deliver and remove fluid to and from a surface of the substrate at substantially a same time to maintain the fluid meniscus between the surface of the proximity head and the surface of the substrate; applying the fluid meniscus to a surface of the substrate, the applying being performed by moving the fluid meniscus across the surface of the substrate, which enables progressive processing of unprocessed regions of the substrate as the fluid meniscus moves across the surface of the substrate; and while the fluid meniscus moves across the surface of the substrate, managing a substrate processing environment so evaporation of fluids in unprocessed regions of the substrate is reduced.