| 摘要 |
<p>A semiconductor laser diode package system and a method thereof are provided to improve an optical property of a semiconductor laser diode by removing a hydrocarbon pollution source absorbed on a cleavage surface of a semiconductor laser diode. An oxygen plasma ashing apparatus(200) removes a hydrocarbon pollution source absorbed on a cleavage surface of a semiconductor laser diode. A cap sealing welder(210) performs a cap welding process in order to protect the semiconductor laser diode from outside. A transfer apparatus(220) transfers the semiconductor laser diode to the cap sealing welder by the oxygen plasma ashing apparatus. The cap sealing welder includes a housing, a cap loading part, an arc welding part, and an injection pipe. The arc welding part is formed on a top part of the cap loading part, and welds a cap on a stem of the semiconductor laser diode.</p> |
