发明名称 LEAD FRAME AND MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame which can inhibit decrease in a strength of a lead part even when a width of the lead part is decreased thereby to prevent deformation of the lead part.SOLUTION: A lead frame 10 comprises: a die pad 11; and a plurality of lead parts 12A, 12B including outer terminals 17A, 17B which are located on an inner edge of the lead parts. The outer terminals 17A, 17B of the plurality of lead parts 12A, 12B are arranged in a zigzag manner so as to be alternately located inside and outside between the adjacent lead parts 12A, 12B. The lead part 12A includes an outside region 52 located outside the outer terminal 17A and an outer terminal region 53 where the outer terminal 17A is formed on a rear face 53b, and the outside region 52 is formed to be thin-walled by half etching. The outside region 52 has a protruded part 52d which protrudes in a rear face direction in a cross section orthogonal to a longer direction of the lead part 12A.
申请公布号 JP2014212207(A) 申请公布日期 2014.11.13
申请号 JP20130087695 申请日期 2013.04.18
申请人 DAINIPPON PRINTING CO LTD 发明人 SHIBAZAKI SATOSHI;TOMITA KOJI;YAZAKI MASAKI;MIYANO KAZUYUKI;KURAHASHI ATSUSHI;UCHIUMI KAZUHITO
分类号 H01L23/50 主分类号 H01L23/50
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