| 摘要 |
PROBLEM TO BE SOLVED: To reduce a protrusion height of resin sealing a bonding wire.SOLUTION: A thermal print head 10 comprises: a heat radiation plate 30; a head substrate 20; a circuit board 40; and a screw 70. The head substrate 20: which includes heating resistors 26 arranged on a surface of a rectangular insulating substrate at intervals; and electrodes connected to both end portions of each of the heating resistors 26, respectively, is mounted on the heat radiation plate 30. The circuit board 40 is mounted on the heat radiation plate 30 such that a major side of the circuit board 40 can face that of the head substrate 20. A plurality of bonding wires 44 electrically connecting the heating resistors 26 to the circuit board 40 is bridged between the head substrate 20 and the circuit board 40. The bonding wires 44 and the like are sealed with heat-curable sealing resin 48. The screw 70 is screwed to the side face of the heat radiation plate 30 at each of a plurality of positions in a main scanning direction so that the head substrate 20 is pushed to the side of the circuit board 40. |
