OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF OPTICAL WIRING SUBSTRATE AND OPTICAL MODULE

摘要

An optical wiring substrate includes a first conductor layer including a metal, a second conductor layer including a metal and arranged parallel to the first conductor layer, an insulation layer disposed to insulate the first conductor layer from the second conductor layer, and an electronic component including a photoelectric conversion element mounted on the substrate, and a via hole formed in the second conductor layer and the insulation layer so as to pass through the second conductor layer and the insulation layer in a thickness direction thereof, the via hole including an inner surface plated with a metal. The via hole is configured such that at least a part of a bottom surface thereof blocked by the first conductor layer is arranged in a plan view so as to overlap with an arrangement position of a pad of the electronic component that is mounted on the first conductor layer.

主权项

1. An optical wiring substrate, comprising:
a first conductor layer comprising a metal; a second conductor layer comprising a metal and arranged parallel to the first conductor layer; an insulation layer disposed to insulate the first conductor layer from the second conductor layer; and an electronic component including a photoelectric conversion element mounted on the substrate; and a via hole formed in the second conductor layer and the insulation layer so as to pass through the second conductor layer and the insulation layer in a thickness direction thereof, the via hole comprising an inner surface plated with a metal, wherein the via hole is configured such that at least a part of a bottom surface thereof blocked by the first conductor layer is arranged in a plan view so as to overlap with an arrangement position of a pad of the electronic component that is mounted on the first conductor layer.