发明名称 DEVICE FOR DRILLING A SUBSTRATE AND A METHOD FOR DRILLING A SUBSTRATE
摘要 A device is used for drilling a substrate, in particular a device for generating a hole or recess or well in an electrically insulating or semiconducting substrate, more specifically a device for generating a plurality of holes or recesses or wells in an electrically insulating or semiconducting substrate.
申请公布号 US2014332513(A1) 申请公布日期 2014.11.13
申请号 US201414445838 申请日期 2014.07.29
申请人 ASAHI GLASS COMPANY, LIMITED 发明人 DITTMANN Leander
分类号 B23K26/38;B23K26/16;H01L21/67;H01L21/268;H01L21/263 主分类号 B23K26/38
代理机构 代理人
主权项 1. A device for drilling an electrically insulating or semiconducting substrate to generate a plurality of holes or recesses or wells in the substrate, said device comprising: an AC voltage source; a DC voltage source; a first electrode and a second electrode; a user-programmable timing and control unit; and a laser, said first electrode being a ground electrode, said second electrode being a voltage electrode for applying a voltage to a substrate, said AC voltage source being connected to said second electrode; said DC voltage source having a DC voltage output also connected to said second electrode, said DC voltage source comprising a plurality of DC voltage supplies and a plurality of switches, each DC voltage supply comprising a capacitor for storing a discrete amount of electrical energy, each DC voltage supply having a switch allocated which is selected from said plurality of switches, each DC voltage supply being connected to said DC voltage output via its own allocated switch, such that said DC voltage output of said DC voltage source is fed by said plurality of DC voltage supplies which are connected thereto by said plurality of switches in parallel, said laser, said AC voltage source, said DC voltage source and said plurality of switches being connected to and controlled by said timing and control unit.
地址 Tokyo JP