| 发明名称 |
CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING ELEMENT |
| 摘要 |
The present invention relates to a curable resin composition comprising (A) an epoxy compound having at least three epoxy groups per molecule and (B) an active hydrogen compound. |
| 申请公布号 |
WO2014181754(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
WO2014JP62092 |
申请日期 |
2014.05.01 |
| 申请人 |
ASAHI KASEI CHEMICALS CORPORATION |
发明人 |
KAJI SATORU;WATANABE RYOKO;KODAMA TAMOTSU |
| 分类号 |
C08G59/32;C08L63/00;H01L23/29;H01L23/31;H01L33/56 |
主分类号 |
C08G59/32 |
| 代理机构 |
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代理人 |
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