发明名称 A MODULAR FRAMEWORK SYSTEM WITH EMI/RFI SUPPRESSION FOR AN ELECTRONIC DEVICE
摘要 <p>A frame structure according to various embodiments can include a corner member comprising three mutually perpendicular protrusions and three profile members. Each perpendicular protrusion can be configured having a substantially open cross section. Each profile member can be configured having at least one double angle cut end, which is arranged to fit within and attach to respective perpendicular protrusions such that the double angle cut ends are joined together to form an angled connection within the corner member.</p>
申请公布号 WO2014182302(A1) 申请公布日期 2014.11.13
申请号 WO2013US40253 申请日期 2013.05.09
申请人 GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC. 发明人 ROWBOTHAM, ALLEN, J.
分类号 H05K5/00;G11B33/14;H05K9/00 主分类号 H05K5/00
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