| 摘要 |
<p>The present invention discloses a semiconductor material aligning device, a semiconductor material incision aligning device, and a method for cutting and aligning semiconductor materials, The semiconductor material aligning device according to an embodiment of the present invention includes: a first aligning table moving along a first aligning table transfer rail; a second aligning table moving along a second aligning table transfer rail a loading picker which attracts the semiconductor materials on the first or second aligning table to transfer the semiconductor materials; and a tray which stores the semiconductor materials attached to the loading picker to be transferred. The first aligning table includes: a loading groove on where the semiconductor materials are loaded to be aligned in an appropriate position; and a first loading unit including non-loading areas which are without the semiconductor materials and are alternatively formed in the x and y axes. The second aligning table includes: another/ loading groove on where the semiconductor materials are loaded to be aligned in an appropriate position; and a second loading unit including other non-loading areas which are without the semiconductor materials and are alternatively formed in the x and y axes.</p> |
