| 摘要 |
Disclosed is a photosensitive resin composition which has excellent photocuring properties, excellent developing properties, and excellent insulating reliability in a fine-pitch wiring pattern and also has good plating resistance. The photosensitive resin composition comprises (a) a radical-polymerizable compound containing a carboxyl group, (b) a polyimide resin, (c) an epoxy resin, (d) a photopolymerization initiator, and (e) a reactive diluent. Preferably, the polyimide resin (b) to be used is a polyimide resin having an isocyanurate ring, a cyclic aliphatic structure and an imide ring. |
