| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor sealing silicone resin composition which excels in curability in a sealed system, adhesion, wet heat adhesion resistance, and wet heat coloring stability. <P>SOLUTION: The optical semiconductor sealing silicone resin composition contains (A) a (meth)acrylic-modified organopolysiloxane which has two or more functional groups represented by formula (I) (wherein R<SP>1</SP>is hydrogen or a methyl group and R<SP>4</SP>is a 1-8C divalent hydrocarbon group) and one or more alkoxysilyl groups in one molecule and a weight average molecular weight of 10,000-150,000, (B) a radical initiator, and (C) a bis(alkoxysilyl)alkane. <P>COPYRIGHT: (C)2011,JPO&INPIT |
