| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive resin composition having excellent thermal conductivity in a cured product of the composition and hardly causing deterioration in adhesive power or insulating properties. <P>SOLUTION: The adhesive resin composition contains an epoxy resin, a curing agent comprising a liquid phenol novolac having a hydroxyl group equivalent ranging from 130 to 200, a curing accelerator, a phenoxy resin and an alumina powder, and contains 50 ppm by weight or less of ammonium ion in a cured product of the adhesive resin composition. The alumina powder has the maximum particle diameter of 120μm or less, and contains crystalline spherical alumina in an amount of 90 wt.% or more in the whole alumina powder. The crystalline spherical alumina includes: (i) particles having an average particle diameter D<SB POS="POST">50</SB>of 35 to 50μm and having a [volume average particle diameter]/[number average particle diameter] in the range from 1.2 to 2.0, of 30 to 50 wt.%; (ii) particles having an average particle diameter D<SB POS="POST">50</SB>of 5 to 15μm and having a [volume average particle diameter]/[number average particle diameter] in the range from 2.0 to 3.5, of 30 to 50 wt.%; and (iii) particles having an average particle diameter D<SB POS="POST">50</SB>of 0.1 to 2μm, of 10 to 30 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
