SEMICONDUCTOR PACKAGE HAVING A EMI SHIELDING AND HEAT DISSIPATION FUNCTION

摘要

The present invention relates to a semiconductor package. The semiconductor package comprises a substrate; a semiconductor chip located on the top surface of the substrate; signal wires formed on the top surface of the substrate, to which different types of signals are inputted and outputted; an earthing wire part which is formed on the top surface of the substrate and divides the wires to which the same signals are inputted and outputted; partitions which touch the earthing wire part; and a heat dissipation part arranged on the semiconductor chip. The earthing wire part includes diagonal earthing wires located in the diagonal direction of the substrate on the center of the semiconductor chip. The heat dissipation part includes a thermal interface material (TIM) located on the top surface of the semiconductor chip and a heat dissipation plate covering the TIM and the substrate.