| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a device with a protective cover without using an etchant. <P>SOLUTION: The device with a protective cover is provided with a device region formed with a device 12 in the region demarcated by first splitting scheduled lines 11a and second splitting scheduled lines, and an outer peripheral surplus region surrounding the device region. Penetration grooves 22a, 22b are formed in a region corresponding to the plurality of bonding pads 13 arranged in one direction on the device 12 and on a protective cover wafer 2 excluding the outer peripheral edge corresponding to the outer peripheral surplus region. The penetration grooves are made to correspond to the bonding pads 13 and the device forming face 10 of a device wafer 1 is stuck to the protective cover wafer 2 to expose the bonding pads 13 via the penetration grooves 22a, 22b, and the stuck wafers are split along the first splitting scheduled lines 11a and second splitting scheduled lines. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
