Encapsulated component with active element and implantable medical device comprising said component

摘要

#CMT# #/CMT# The component (100) has an active element (106) hermetically encapsulated in a cavity (116) formed between a support (102) and a cover (114) that are made by electrically conductive material. The active element is securely attached to the support through a dielectric layer positioned between the support and the active element. An electrical connection (210) includes a portion of electrically conductive material electrically connected to the cover, and is electrically contacted with an electrically conductive sealing bead (118) providing a hermetic secure attachment of the cover to the support. #CMT# : #/CMT# An independent claim is also included for a method for producing an encapsulated component. #CMT#USE : #/CMT# Encapsulated component for an implantable medical device (claimed). Uses include but are not limited to a device for supervising cardiac activity and for generating stimulation pulses, resynchronisation pulses, defibrillation pulses and/or cardioversion pulses in the event of detection of cardiac disorders, a neurological device, a pump for diffusing medical substances, a cochlear implant, an implanted biological sensor, a pH measuring device and an intracorporeal impedances measuring device. #CMT#ADVANTAGE : #/CMT# The active element is hermetically encapsulated in the cavity formed between the support and the cover that are made by electrically conductive material so as to avoid complexity for manufacturing the component in an inexpensive manner. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional view of an encapsulated component. 100 : Encapsulated component 102 : Support 106 : Active element 114 : Cover 116 : Cavity 118 : Electrically conductive sealing bead 210 : Electrical connection.