| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board which ensures adhesion of solder resist onto an insulating layer after a metal foil is removed even in a case where a metal foil having a low surface roughness on the surface adhering to the insulating layer is used, while exhibiting excellent reliability for PCT, having fine wiring, and reducing transmission loss of high frequency signal. <P>SOLUTION: In a circuit board having a conductor pattern which is formed by removing the metal foil from a laminate with a metal foil where a metal foil is bonded onto an insulating layer, a rough surface shape is formed on the surface of the insulating layer which is exposed after removing the metal foil. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
