POWER MODULE AND ENCAPSULATION METHOD THEREOF

摘要

The present invention provides a power supply module and a method for packaging a power supply module. The power supply module includes a lead frame, an integrated circuit, passive devices, and at least one semiconductor bare chip, where at least one magnetic device in the passive devices is a discrete magnetic device obtained by assembling a magnetic core and an electrical winding; one end of the electrical winding is electrically connected to the lead frame, so that the one end of the electrical winding is electrically connected to the integrated circuit and the passive devices except the magnetic device by means of the lead frame; and the other end of the electrical winding is electrically connected to the semiconductor bare chip directly. According to the present invention, a failure probability of a winding magnetic device in a power supply module is lowered, and reliability of the power supply module is improved.