发明名称 光電子半導体部品
摘要 <p>An optoelectronic semiconductor component, comprising a carrier substrate, and an interlayer that mediates adhesion between the carrier substrate and a component structure. The component structure comprises an active layer provided for generating radiation, and a useful layer arranged between the interlayer and the active layer. The useful layer has a separating area remote from the carrier substrate.</p>
申请公布号 JP5623074(B2) 申请公布日期 2014.11.12
申请号 JP20090506911 申请日期 2007.04.25
申请人 发明人
分类号 H01S5/187;H01L33/00;H01L33/22;H01L33/40;H01L33/46 主分类号 H01S5/187
代理机构 代理人
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