| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition for filling between a flat panel display module and a transparent cover board which can be cured by light at high speed, is not made uncured even in a portion which is not irradiated with light and has excellent visibility, impact resistance, heat resistance and light resistance of a cured product thereof. <P>SOLUTION: The curable composition contains a compound (A) having at least one hydrolyzable silyl group in one molecule on the average and a compound (B) having at least one polymerizable carbon-carbon double bond in one molecule on the average. <P>COPYRIGHT: (C)2011,JPO&INPIT |
