发明名称 Fabrication methods of thermoelectric thin film modules using moulds consisting of via-holes and thermoelectric thin film modules produced using the same method
摘要 <p>The present invention relates to a thermoelectric thin film module. In particular, the present invention provides a method for manufacturing a thermoelectric thin film module and the thermoelectric thin film module manufactured by the same. According to the method, the thermoelectric thin film module is manufactured by forming n-type thermoelectric thin film legs and p-type thermoelectric thin film legs with a mold having via-holes so as to simplify a manufacturing method and to enhance properties and reliability of the module.</p>
申请公布号 KR101460880(B1) 申请公布日期 2014.11.12
申请号 KR20130024677 申请日期 2013.03.07
申请人 发明人
分类号 H01L35/02;H01L35/34 主分类号 H01L35/02
代理机构 代理人
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