INTERLEAF PACKING MODULE AND WAFER PACKING SYSTEM HAVING THE SAME

摘要

Disclosed are an interleaf loading module and a wafer packing system having the interleaf loading module. The interleaf loading module includes a base plate, a pair of first blowers and a pair of second blowers. The base plate supports an interleaf. The first blowers are arranged to be opposed to each other in the first direction in a state where the interleaf is interposed between the first blowers. The second blowers are arranged to be opposed to each other in the second direction intersecting with the first direction in a state where the interleaf is interposed between the first blowers. Such an interleaf loading module separates the interleaves one by one and pulls them apart, thereby making conveyance of the interleaves easy and preventing the plural interleaves from being conveyed at once.