SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Provided are a semiconductor package and a method for manufacturing the same. The semiconductor package according to the present invention includes a lower package including a lower semiconductor chip, an upper package, connection parts, and a molding layer. A protection layer covers the upper surface of the lower semiconductor to prevent damage to the lower semiconductor chip. The uppermost surface of the protection layer has the same level as the uppermost surface of the molding layer and can be separated from the upper package.