发明名称 Method of fabrication of a FinFET element
摘要 The present disclosure provides a method of fabricating a FinFET element including providing a substrate including a first fin and a second fin. A first layer is formed on the first fin. The first layer comprises a dopant of a first type. A dopant of a second type is provided to the second fin. High temperature processing of the substrate is performed on the substrate including the formed first layer and the dopant of the second type.
申请公布号 US8883597(B2) 申请公布日期 2014.11.11
申请号 US200711831098 申请日期 2007.07.31
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chang Cheng-Hung;Yu Chen-Hua;Yeh Chen-Nan;Fu Chu-Yun;Hsu Yu-Rang;Chen Ding-Yuan
分类号 H01L21/8236;H01L21/8238;H01L29/78;H01L29/66 主分类号 H01L21/8236
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A method of fabricating a FinFET element comprising: providing a substrate including a first fin and a second fin; forming a first silica glass layer on the first fin, wherein the forming the first silica glass layer includes forming a plasma-enhanced phosphosilicate glass (pe-PSG) layer; forming an oxide layer on the pe-PSG layer and the second fin; providing a dopant of a second type performing a vapor phase diffusion process to diffuse the dopant of the second type into the oxide layer to form a doped layer; and after forming the pe-PSG layer and forming the doped layer, performing high temperature processing of the substrate, wherein the performing high temperature processing of the substrate provides for driving a dopant of the pe-PSG into the first fin and the dopant of the second type into the second fin by a solid phase diffusion process to form channels of transistor devices.
地址 Hin-Chu TW