Method of manufacturing rigid-flexible printed circuit board

摘要

The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

主权项

1. A method of manufacturing a rigid-flexible printed circuit board, which comprises:
providing a first flexible film having a first metal layer on one or both surfaces; forming a first circuit pattern by patterning the first metal layer provided on the first flexible film; forming, on one or both surfaces of the first flexible film, a second flexible film that has a second metal layer on one surface thereof; forming a second circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F such that a portion of the second metal layer is between the anti-oxidation protective layer and the first circuit pattern; oxidizing the second circuit pattern to improve adhesion, excluding regions of the second circuit pattern covered by the anti-oxidation protective layer; laminating circuit layers on the second flexible film; and removing the circuit layer in the flexible domain F.