发明名称 |
Phase change memory apparatus and fabrication method thereof |
摘要 |
A phase change memory apparatus is provided that includes a first electrode that is longer than it is wide, the first electrode having a trench formed on an active region of a semiconductor substrate, a second electrode formed in a bottom portion of the trench, and a bottom electrode contact formed on the second electrode. |
申请公布号 |
US8883590(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201213731522 |
申请日期 |
2012.12.31 |
申请人 |
SK Hynix Inc. |
发明人 |
Lee Jang Uk |
分类号 |
H01L21/8234;H01L27/24;H01L45/00 |
主分类号 |
H01L21/8234 |
代理机构 |
Ladas & Parry LLP |
代理人 |
Ladas & Parry LLP |
主权项 |
1. A method of manufacturing a phase change memory apparatus, comprising:
forming a selective epitaxial growth layer on an active region of a semiconductor substrate; forming a trench in the selective epitaxial growth layer; forming an electrode having an opposite conductivity to the selective epitaxial growth layer in a portion of the trench in order to form a diode by the selective epitaxial growth layer and the electrode; and forming a contact hole in the selective epitaxial growth layer to expose a portion of the active region; forming an ionization layer on a side wall of the contact hole; and forming a word line contact within the contact hole forming an electrode contact on the electrode, wherein the electrode contact is formed on the electrode to a determined height within the trench. |
地址 |
Gyeonggi-do KR |