| 发明名称 | Multichip device | ||
| 摘要 | A multichip device includes a first semiconductor chip arranged over a first carrier and a second semiconductor chip arranged over a second carrier. The multichip device further includes an electrically conductive element electrically coupling the first semiconductor chip and the second semiconductor chip. The electrically conductive element includes a first exposed contact area. | ||
| 申请公布号 | US8884420(B1) | 申请公布日期 | 2014.11.11 |
| 申请号 | US201313940577 | 申请日期 | 2013.07.12 |
| 申请人 | Infineon Technologies Austria AG | 发明人 | Hosseini Khalil;Mahler Joachim;Nikitin Ivan |
| 分类号 | H01L33/00;H01L23/495 | 主分类号 | H01L33/00 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A multichip device, comprising: a first semiconductor chip arranged over a first carrier; a second semiconductor chip arranged over a second carrier; and an electrically conductive element electrically coupling the first semiconductor chip and the second semiconductor chip, wherein the electrically conductive element comprises a first exposed contact area. | ||
| 地址 | Villach AT | ||