Exposure method, exposure apparatus, and method of manufacturing device

摘要

An exposure method comprises: a first detection step of detecting a position of a first mark by a first scope; a second detection step of detecting a position of a second mark by a second scope having a magnification higher than the first scope; a first calculation step of calculating a first correction value based on the detection results obtained in the first and second detection steps; a third detection step of detecting a position of a third mark by the second scope after the substrate is aligned based on the first correction value calculated in the first calculation step; a second calculation step of calculating a second correction value based on the detection results obtained in the second and third detection steps; and an exposure step of exposing the substrate after the substrate is aligned based on the second correction value calculated in the second calculation step.

主权项

1. An alignment method by aligning a substrate using a mark formed on the substrate, the method comprising:
a first detection step of detecting a position of a first mark by detecting the first mark using a first scope; a shift step of shifting the substrate, based on a shift correction value obtained from a detection result in the first detection step, from a position of the substrate where the first mark was detected by the first scope to a position of the substrate where a second mark, different from the first mark, enters a field of a second scope, the magnification of which is higher than the magnification of the first scope of the first detection step; a second detection step of detecting a position of the second mark which has entered the field of the second scope, the magnification of which is higher than the magnification of the first scope of the first detection step, by detecting the second mark using the second scope, the magnification of which is higher than the magnification of the first scope of the first detection step, without detecting a position of the second mark by detecting the second mark using the first scope; a first calculation step of calculating a first correction value based on the result of detecting the position of the first mark and the result of detecting the position of the second mark; a third detection step of detecting a position of a third mark different from the first mark and the second mark by detecting the third mark using the second scope, the magnification of which is higher than the magnification of the first scope of the first detection step after the substrate is aligned based on the first correction value; and a second calculation step of calculating a second correction value based on the result of detecting the position of the second mark and the result of detecting the position of the third mark; wherein the second mark is selected from marks arranged at positions from which the marks are allowed to enter the field of the second scope of the second detection step, correcting the position of the substrate by the shift correction value.