Circuit board sensor and method for producing the same

摘要

The invention relates to a circuit board sensor (1) for measuring physical variables, comprising a substrate board (2) and a second board (3) both made of glass, wherein at least the second board (3) is designed such that said board is elastically deformable, wherein the substrate board (2) and the second board (3) each comprise a first and a second side (2a, 2b, 3a, 3b), wherein the second side (2b) of the substrate board (2) and the first side (3a) of the second board (3) are disposed opposite each other, and wherein a spacer element (7) is disposed between the substrate board (2) and the second board (3) and holds the substrate board (2) and the second board (3) at a mutual distance, wherein the substrate board (2) and the second board (3) extend in particular parallel to each other, wherein the second side (2b) of the substrate board (2) comprises a first metal or polymer surface (5a) and the first side (3a) of the second board (3) comprises a second metal or polymer surface (5b), and wherein the first and second metal or polymer surfaces (5a, 5b) are disposed at least partially opposite each other, and wherein conductors (4) are attached on the first side of the substrate board (2), and wherein the substrate board (2) comprises at least one first and one second through-plating (9) disposed such that the first through-plating (9a) electrically conductively connects the conductors (4) to the first metal or polymer surface (5a), and such that the second through-plating (9b) electrically conductively connects the conductor (4) to the second metal or polymer surface (5b).

主权项

1. A circuit board sensor for measuring physical parameters, comprising
a base plate as well as a second plate which are both composed of glass, wherein at least the second plate is designed such that it is elastically deformable, wherein the base plate as well as the second plate each have a first side and a second side wherein the second side of the base plate as well as the first side (3a)of the second plate are arranged opposite to one another and wherein a spacer element is arranged between the base plate and the second plate which maintains the base plate as well as the second plate at a mutual spacing, wherein the base plate and the second plate are in particular mutually parallel, wherein the second side of the base plate has a first metallic or polymeric surface and the first side of the second plate has a second metallic or polymeric surface, and wherein the first and second metallic or polymeric surfaces are at least partially arranged opposite one another, wherein conductive paths are provided at the first side of the base plate, and wherein the base plate has at least a first and second through contact which are arranged such that the first through contact electrically conductively connects the conductive path to the first metallic or polymeric surface, and such that the second through contact electrically conductively connects the conductive path to the second metallic or polymeric surface.