发明名称 |
Image forming apparatus, chip, and chip package |
摘要 |
An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals. |
申请公布号 |
US8884423(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US200912485369 |
申请日期 |
2009.06.16 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Park Seung-hun;Hong Eun-ju |
分类号 |
H01L23/52;H01L27/146;H01L23/50;H01L23/498 |
主分类号 |
H01L23/52 |
代理机构 |
Staas & Halsey LLP |
代理人 |
Staas & Halsey LLP |
主权项 |
1. An image forming apparatus comprising,
an engine unit to form an image, and a board unit comprising a chip package, to control the engine unit, the chip package comprising: a chip; a plurality of first pads disposed on the chip and configured to transmit data signals; a plurality of second pads disposed on the chip and configured to transmit address signals; and a ground pad disposed on the chip between the first pads and the second pads, the ground pad configured to reduce cross-talk between the data signals and the address signals, wherein the plurality of first pads are configured to transmit a complete set of the data signals and are consecutively disposed on the chip such that no ground pad is disposed between any two adjacent ones of the first pads; and wherein the first pads, the ground pad, and the second pads are consecutively arranged on the chip in a linear shape. |
地址 |
Suwon KR |