Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture

摘要

A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion). The vent hole may be formed from a first opening extending from the first surface toward the second surface to a first depth that is less than a thickness of the leadframe feature, and a second opening extending from the second surface toward the first surface to a second depth that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

主权项

1. A device comprising:
a leadframe feature having a first surface, a second surface opposed to the first surface, and a vent hole formed between the first surface and the second surface, wherein a cross-sectional area of the vent hole varies substantially between the first surface and the second surface; and molding compound partially encapsulating the leadframe feature, wherein the molding compound is not disposed within the vent hole.