| 发明名称 | Light emitting device package | ||
| 摘要 | The light emitting device package may include a light emitting device including at least one light emitting diode and a body including at least one lead frame on which a light emitting device is disposed, the body provided a first protrusion formed on a outside of the body, wherein the width of a lower surface of the first protrusion is 0.5 times to 0.9 times the width of a upper surface of the first protrusion. | ||
| 申请公布号 | US8882294(B2) | 申请公布日期 | 2014.11.11 |
| 申请号 | US201113177853 | 申请日期 | 2011.07.07 |
| 申请人 | LG Innotek Co., Ltd. | 发明人 | Lee JooSeok |
| 分类号 | F21V15/01;H01L33/48;F21Y101/02;F21K99/00 | 主分类号 | F21V15/01 |
| 代理机构 | Ked & Associates, LLP | 代理人 | Ked & Associates, LLP |
| 主权项 | 1. A light emitting device package, comprising: a light emitting device including at least one light emitting diode; and a body including at least one lead frame on which a light emitting device is disposed, the body provided a first protrusion and a second protrusion formed on an outside of the body, wherein at least one of the width of a lower surface of the first protrusion and a second protrusion is 0.5 times to 0.9 times the width of an upper surface, wherein at least one of the first protrusion and the second protrusion has an inclination angle of 50 degrees to 89 degrees with respect to the lower surface of the body. | ||
| 地址 | Seoul KR | ||