| 摘要 |
<p>The present invention relates to a device to treat an alignment layer using plasma, comprising: a temporary curing unit to temporarily cure an alignment layer by heating the alignment layer using plasma such that the alignment layer formed on a transferred substrate can uniformly be cured; a curing unit to cure the alignment layer by reheating the alignment layer using the plasma; a rubbing unit to rub the alignment layer by etching the alignment layer using the plasma; and a transferring unit to transfer the substrate to consecutively pass through the temporary curing unit, the curing unit, and the rubbing unit. According to the present invention, the transferring time of the substrate having the alignment layer formed thereon can be reduced, thereby minimizing the defects generated by a temperature difference.</p> |
