发明名称 Process for producing a liquid ejection head
摘要 A process for producing a liquid ejection head including, on a substrate, a flow path forming member forming ejection orifices and a liquid flow path communicating therewith, including forming, on the substrate, a first layer of photosensitive resin; forming, on the first layer, a mask layer in which at least part of a side surface thereof has a light transmission distribution with a material capable of reducing transmission of light having a photosensitive wavelength of the resin; performing, for the first layer, exposure with the mask layer and development to form a flow path mold pattern having a taper angle θ satisfying 95°<θ, where θ is the angle between top and side surfaces in cross section of the pattern perpendicular to substrate surface; forming a coating resin layer to cover the pattern; patterning the resin layer to form the member; and removing the pattern to form the flow path.
申请公布号 US8883404(B2) 申请公布日期 2014.11.11
申请号 US201414146463 申请日期 2014.01.02
申请人 Canon Kabushiki Kaisha 发明人 Ishikawa Tetsushi;Sato Tamaki
分类号 B41J2/16 主分类号 B41J2/16
代理机构 Fitzpatrick, Cella, Harper &amp; Scinto 代理人 Fitzpatrick, Cella, Harper &amp; Scinto
主权项 1. A process for producing a liquid ejection head including, on a substrate, a flow path forming member that forms an ejection orifice for ejecting liquid and a liquid flow path communicating with the ejection orifice, the process comprising: (1) forming, on the substrate, a first layer made of a first photosensitive resin; (2) forming, on the first layer, a mask layer in which at least a part of a side surface part of the mask layer has a light transmission distribution with use of a material capable of reducing transmission of light having a photosensitive wavelength of the first photosensitive resin; (3) performing, for the first layer, a first exposure treatment with use of the mask layer as a mask and a first development treatment to form a flow path mold pattern that forms a mold of the liquid flow path, the flow path mold pattern having a taper angle θ that satisfies 95°<θ, where θ is the angle between a top surface and a side surface in a cross section of the flow path mold pattern perpendicular to a surface of the substrate; (4) forming a coating resin layer so as to cover the flow path mold pattern; (5) patterning the coating resin layer so as to form the flow path forming member having the ejection orifice; and (6) removing the flow path mold pattern to form the liquid flow path.
地址 Tokyo JP