发明名称 Ablation layer, photosensitive resin structure, and method for producing relief printing plate using the photosensitive resin structure
摘要 A photosensitive resin structure having an ablation layer for a photosensitive resin for a relief printing that is capable of being processed by infrared radiation and containing an anionic polymer, a relief printing plate is produced by drawing a pattern by irradiating the ablation layer with infrared radiation; exposing the pattern by irradiating the photosensitive resin layer with ultraviolet radiation; and removing the ablation layer and unexposed photosensitive resin layer with a developer.
申请公布号 US8883399(B2) 申请公布日期 2014.11.11
申请号 US200913133289 申请日期 2009.12.18
申请人 Asahi Kasei E-Materials Corporation 发明人 Iso Chisato
分类号 C08F20/06;G03C1/00;G03F7/00;G03F7/26;G03F7/20;G03F1/00 主分类号 C08F20/06
代理机构 Greenblum & bernstein, P.L.C. 代理人 Greenblum & bernstein, P.L.C.
主权项 1. An ablation layer for a photosensitive resin for a relief printing, the ablation layer capable of being processed by infrared radiation, and the ablation layer comprising: an anionic polymer comprising at least one group selected form the group consisting of a phosphoric acid group, a sulfonic acid group, a carboxylic acid group, and a phenolic hydroxyl group, and a polymer having an ester bond in a side chain and having a saponification degree of from 0% to 80%, which is at least one of polyvinyl alcohol and polyvinyl acetate; wherein the ablation layer can be removed with an aqueous developer.
地址 Tokyo JP