发明名称 Substrate processing apparatus and substrate processing method
摘要 A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.
申请公布号 US8883030(B2) 申请公布日期 2014.11.11
申请号 US201213596903 申请日期 2012.08.28
申请人 SCREEN Holdings Co., Ltd. 发明人 Miyagi Masahiro;Hashimoto Koji;Endo Toru
分类号 B44C1/22;B05B1/00;B05D1/02;H01L21/67;B05C13/00;B05C11/10 主分类号 B44C1/22
代理机构 Ostrolenk Faber LLP 代理人 Ostrolenk Faber LLP
主权项 1. A substrate processing method comprising the steps of: rotating a substrate; reserving a process liquid in a process liquid reservoir in a predetermined amount sufficient to form a liquid film covering the whole area of a principal face of the substrate; forming the liquid film covering the whole area of the principal face of the substrate by supplying process liquid reserved by the process liquid reservoir toward the principal face of the substrate being rotated; wherein the liquid film forming step includes the steps of supplying pressurized gas to pressurize said process liquid reservoir and then using said pressurized gas to push out the process liquid reserved in the process liquid reservoir, and thereby supply said process liquid to said substrate in a single burst; and after the liquid film forming step, dispensing the process liquid from a process liquid nozzle toward the principal face of the substrate being rotated.
地址 JP