发明名称 Mount for a scanning probe sensor package, scanning probe sensor package, scanning probe microscope and method of mounting or dismounting a scanning probe sensor package
摘要 A mount for a scanning probe sensor package (27) comprises a support structure (1, 5) defining a plane within the mount and at least one movable snap joint element (9) designed for interacting with a respective counterpart (43) in a scanning probe sensor package (27). The snap joint element (9) is movable to a first position in which it exerts a force on a mounted scanning probe sensor package (27) so as to force said scanning probe sensor package (27) in a normal direction of said plane towards the support structure (1,5) and to a second position in which it allows a scanning probe sensor package (27) to be mounted to or dismounted from the support structure (1, 5) along normal direction of said plane.
申请公布号 US8884222(B2) 申请公布日期 2014.11.11
申请号 US201013502171 申请日期 2010.10.05
申请人 SPECS Surface Nano Analysis GmbH 发明人 Rychen Joerg
分类号 G01N23/00;G01Q70/02;B82Y35/00 主分类号 G01N23/00
代理机构 Rothwell, Figg, Ernst & Manbeck, P.C. 代理人 Rothwell, Figg, Ernst & Manbeck, P.C.
主权项 1. A mount for a scanning probe sensor package, the mount comprising: a support structure defining a plane within said mount; at least one movable snap joint element designed for interacting with a respective counterpart in a scanning probe sensor package, at least one resilient member for providing a biasing force biasing said at least one snap joint element towards a first position in which it projects in radial direction towards the center of said plane, and for exerting a force towards said support structure so as to force a mounted scanning probe sensor package towards said plane through said at least one snap joint, and wherein the snap joint element is movable against the biasing force provided by said at least one resilient member to a second position which is radially further away from the center of said plane as said first position and in which it allows a scanning probe sensor package to be mounted to or dismounted from said support structure along a normal direction of said plane.
地址 Berlin DE