| 发明名称 |
Circuit assembly |
| 摘要 |
A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane. |
| 申请公布号 |
US8884169(B2) |
申请公布日期 |
2014.11.11 |
| 申请号 |
US201213539553 |
申请日期 |
2012.07.02 |
| 申请人 |
Delphi Technologies, Inc. |
发明人 |
Jozwiak Andrew J. |
| 分类号 |
H01B5/00;H05K7/02 |
主分类号 |
H01B5/00 |
| 代理机构 |
|
代理人 |
Hazelton Lawrence D. |
| 主权项 |
1. A circuit assembly comprising:
a planar lead frame formed of electrically conductive material having a first thickness, said lead frame configured to define a routing plane and a plurality of coplanar sections in the routing plane; a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness, said top-side terminal configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane, wherein said top-side terminal is characterized as one of a connector terminal and a component lead fork. |
| 地址 |
Troy MI US |
