Packaging device and base member for packaging

摘要

An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate having a plurality of through electrodes arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes are led out to an external circuit with a contact medium arranged to bypass a sealant being interposed between the group of electrodes and the through electrodes.

主权项

1. A packaged optoelectronic device comprising:
a semiconductor substrate that has an optoelectronic device structure and an electrical contact structure provided on a first surface of said semiconductor substrate; a transparent glass substrate that is arranged spaced apart from said first surface with a gap therebetween and covering said optoelectronic device structure and said electrical contact structure, and that includes an optically transparent glass window area over said optoelectronic device structure allowing light from an exterior environment to pass through said window area to said optoelectronic device structure; plural metal wire electrodes that respectively extend straight through an entire thickness of said glass substrate in respective vias penetrating through said glass substrate at respective locations beside said window area, wherein said metal wire electrodes are respectively hermetically sealed directly to said glass substrate respectively by glass-to-metal-seals formed in said vias, and wherein said metal wire electrodes further extend continuously and integrally beyond and away from a surface of said glass substrate through said gap and contact said electrical contact structure on said first surface of said semiconductor substrate; and a continuous perimeter seal bead of a sealant material that is sandwiched between and hermetically sealed to said semiconductor substrate and said glass substrate in said gap, along an entire perimeter outwardly around and spaced outwardly away from said metal wire electrodes, said electrical contact structure, said optoelectronic device structure, and said window area; wherein said optoelectronic device structure is hermetically sealed and enclosed from said exterior environment by said semiconductor substrate, said continuous perimeter seal bead, and said glass substrate including said metal wire electrodes sealed in said vias by said glass-to-metal-seals.