发明名称 Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy
摘要 An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.
申请公布号 US8883318(B2) 申请公布日期 2014.11.11
申请号 US201013501533 申请日期 2010.10.25
申请人 Neomax Materials Co., Ltd. 发明人 Yamamoto Shinji;Ishio Masaaki
分类号 B32B15/20;B32B15/01;B23K1/19;B23K20/02;B23K20/16;B23K20/227;B23K20/233;B23K35/00;B23K35/02;B23K35/30;C22C19/00;C22C19/03 主分类号 B32B15/20
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A clad material comprising: a non-aluminum metal layer made of any one non-aluminum metal selected from steel, copper, nickel, and titanium; a bonding alloy layer made of an aluminum bonding alloy consisting essentially of 0.08 mass % or more and 0.90 mass % or less of Mg, and the balance of Ni; and an aluminum layer made of pure aluminum or an aluminum alloy made of an Al—Mn-based alloy or Al—Mg-based alloy comprising 90 mass % or more of Al, wherein the non-aluminum metal layer, the bonding alloy layer, and the aluminum layer are pressured-welded and diffusion-bonded to each other in this order so as to be bonded together.
地址 Osaka JP
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