发明名称 |
Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy |
摘要 |
An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding. |
申请公布号 |
US8883318(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201013501533 |
申请日期 |
2010.10.25 |
申请人 |
Neomax Materials Co., Ltd. |
发明人 |
Yamamoto Shinji;Ishio Masaaki |
分类号 |
B32B15/20;B32B15/01;B23K1/19;B23K20/02;B23K20/16;B23K20/227;B23K20/233;B23K35/00;B23K35/02;B23K35/30;C22C19/00;C22C19/03 |
主分类号 |
B32B15/20 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A clad material comprising:
a non-aluminum metal layer made of any one non-aluminum metal selected from steel, copper, nickel, and titanium; a bonding alloy layer made of an aluminum bonding alloy consisting essentially of 0.08 mass % or more and 0.90 mass % or less of Mg, and the balance of Ni; and an aluminum layer made of pure aluminum or an aluminum alloy made of an Al—Mn-based alloy or Al—Mg-based alloy comprising 90 mass % or more of Al, wherein the non-aluminum metal layer, the bonding alloy layer, and the aluminum layer are pressured-welded and diffusion-bonded to each other in this order so as to be bonded together. |
地址 |
Osaka JP |