发明名称 MRAM device and fabrication method thereof
摘要 A magnetoresistive random access memory (MRAM) device and a method of manufacture are provided. The MRAM device comprises a magnetic pinned layer, a compound GMR structure acting as a free layer, and a non-magnetic barrier layer separating the pinned and GMR layers. The barrier layer is provided to reduce the magnetic coupling of the free layer and GMR structure, as well as provide a resistive state (high or low) for retaining binary data (0 or 1) in the device. The GMR structure provides physical electrode connectivity for set/clear memory functionality which is separated from the physical electrode connectivity for the read functionality for the memory device.
申请公布号 US8884386(B2) 申请公布日期 2014.11.11
申请号 US201213364881 申请日期 2012.02.02
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chiang Tien-Wei;Yu Chwen;Kao Ya-Chen
分类号 H01L29/82 主分类号 H01L29/82
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A magnetoresistive random access memory (MRAM) comprising: a pinned magnetic layer; a barrier layer adjacent the pinned magnetic layer; and a giant magnetoresistance (GMR) structure adjacent the barrier layer, the GMR structure comprising a first magnetic layer, a second magnetic layer, and a conductive layer interposed between the first magnetic layer and the second magnetic layer, wherein the pinned magnetic layer, the barrier layer, and the GMR structure are laterally over a dielectric layer, wherein the MRAM is capable of reading a resistance state between the second magnetic layer and the pinned layer.
地址 Hsin-Chu TW