发明名称 |
MRAM device and fabrication method thereof |
摘要 |
A magnetoresistive random access memory (MRAM) device and a method of manufacture are provided. The MRAM device comprises a magnetic pinned layer, a compound GMR structure acting as a free layer, and a non-magnetic barrier layer separating the pinned and GMR layers. The barrier layer is provided to reduce the magnetic coupling of the free layer and GMR structure, as well as provide a resistive state (high or low) for retaining binary data (0 or 1) in the device. The GMR structure provides physical electrode connectivity for set/clear memory functionality which is separated from the physical electrode connectivity for the read functionality for the memory device. |
申请公布号 |
US8884386(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201213364881 |
申请日期 |
2012.02.02 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chiang Tien-Wei;Yu Chwen;Kao Ya-Chen |
分类号 |
H01L29/82 |
主分类号 |
H01L29/82 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A magnetoresistive random access memory (MRAM) comprising:
a pinned magnetic layer; a barrier layer adjacent the pinned magnetic layer; and a giant magnetoresistance (GMR) structure adjacent the barrier layer, the GMR structure comprising a first magnetic layer, a second magnetic layer, and a conductive layer interposed between the first magnetic layer and the second magnetic layer, wherein the pinned magnetic layer, the barrier layer, and the GMR structure are laterally over a dielectric layer, wherein the MRAM is capable of reading a resistance state between the second magnetic layer and the pinned layer. |
地址 |
Hsin-Chu TW |