发明名称 A COMPOSITE FILM OF COPPER LAYERS WITH INSULATION LAYERS AND CONDUCTIVE ADHESION LAYERS AND METHOD OF FABRICATING THE SAME.
摘要 <p>The present invention makes it possible to fabricate a composite sheet using a multiply layered composite film with a higher anisotropy of heat conductivity obtained by compositely laying a ceramic insulation layer and an electrical conduction layer on a copper thin film so as to increase the horizontal heat conductivity compared to the vertical heat conductivity. Particularly, it is possible to fabricate a composite film with higher horizontal heat conductivity than the vertical heat conductivity that can replace a graphitic heat-diffusion material. To this end is provided a multiply layered composite film with an anisotropic heat conductivity using a copper thin film including an insulation layer and an electrical conduction layer. The present invention proposes a multi-layered composite sheet with a higher anisotropy of heat conductivity obtained by compositely laying a ceramic insulation layer and an electrical conduction layer on a copper thin film so as to increase the horizontal heat conductivity compared to the vertical heat conductivity.</p>
申请公布号 KR101458832(B1) 申请公布日期 2014.11.10
申请号 KR20130017314 申请日期 2013.02.19
申请人 发明人
分类号 B32B15/08;B32B37/00 主分类号 B32B15/08
代理机构 代理人
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