| 摘要 |
A method for the application of at least two different powder coating layers to a substrate comprising the steps of application of a first powder coating layer followed by the application of a second powder coating layer, without any substantial curing of the first powder coating layer prior to the application of the second powder coating layer, followed by the simultaneous curing of the first powder coating layer and the second powder coating layer, wherein the first powder coating layer or the second powder coating layer comprises 1 to 10 weight % of a conductive component having a resistivity of below 5 Ωcm at a packing volume of ≤70%. |
