| 摘要 |
FIELD: electricity.SUBSTANCE: system includes a non-conductive substrate with the main surface. A busbar is formed over a part of the main surface. Current-conducting coating is formed over a part of the busbar and main surface. At a part of the film junction to the busbar there is current-conducting gluing material, for example, isotropic current-conducting band or film. The system may include additionally current-conducting metal foil bonded to the isotropic current-conducting material.EFFECT: provision of sufficient conductivity and improvement of mechanical and chemical protective properties for the components placed below.14 cl, 5 dwg |
