METHOD FOR MANUFACTURING CHASE INSERT OF SEMICONDUCTOR DIE USING HIGH TEMPERATURE SURFACE TREATMENT

摘要

The present invention relates to a method to manufacture a chase insert which is a main component of a semiconductor mold to prevent the transformation of a lead frame by directly touching resin in a molding process which makes the shape of a semiconductor chip by placing the lead frame in a mold and sealing the mold with liquid thermosetting resin. According to the present invention, as a chase insert problem of the existing technology, in which it is impossible to avoid the transformation and degradation of a physical characteristic of a material because high temperature surface treatment is performed between 700°C and 1300°C and the size and shape are seriously transformed due to the contraction and expansion of the product caused by heat, is solved and then the high temperature surface treatment is applied to the chase insert, the physical characteristic such as durability of abrasion or hardness is improved, and transformation is minimized while at the same time the life span is able to be extended.